Micross Components designs, manufactures and distributes specialty electronics solutions for defence, Space, medical, oil and energy, automotive, telecommunications and industrial applications. It offers bar die products, wafer services, including wafer processing, wafer thinning, wafer bumping, wafer sawing, pick and place, visual inspection, wafer probing. Further, the company offers semiconductor assembly an d test services, component modifications and robotic hot solder dipping and solder exchange.